Packaging and testing project for Samsung high-end memory chip completed and commissioned in Xi'an on April 14. Lou Qinjian, Shaanxi governor and non-terminal director of Semiconductor Division of Samsung Electronics attended the project completion ceremony.

Samsung Electronics packaging and testing production line started construction in January 2014. It mainly produces SSDs of 3D vertical flash memory chips. Completion of the project marks Samsung chip plant in Xi'an High-tech Zone became the only overseas production base of manufacturing, packaging and testing of Samsung memory chips.