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China's Silicon Wafer Demonstration Project Completed
February 27 saw China's first production line of 8-inch-diameter silicon single crystal polished wafer being completed and put into production in the General Research Institute for Nonferrous Metals.
The wafer is to be used in 0.25-micron integrated circuit and its yearly production capability is 60m square inches,.
The completion of this demonstration project and the high-tech industrialization indicate that China has reached the world top level on silicon wafer production of very deep sub-micron (VDSM) super large-scale integration.
Along with the further advancement in the integration of super-scale circuits, the size of the chip becomes larger yet the line tends to be thinner. In order to reduce the unit cost of production, the diameter of the wafer increases as well.
Currently, the market share for the 8-inch-diameter silicon single crystal polished wafer has already exceeded 50 percent.
By PD Online Staff Huang Ying
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