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Ningbo to Build Nation's First Semi-conductor Encapsulation District
The coastal city of Ningbo in east China's Zhejiang Province announced recently that it would build China's first semi-conductor encapsulation district.
Covering 900,000 square meters, the district, within the city's development zone, will focus its products on the packaging of chips for mobile communications, industrial control and home appliances.
In three to five years, the district will hopefully account for 15 percent of the packaging volume in the country.
The semi-conductor encapsulation industry, together with chip designing and manufacturing, will become a pillar industry in the micro-electronics industry.
Experts predicted that foreign investment in China, concerning semi-conductor encapsulation, will reach 7.5 billion U.S. dollars in the coming decade. Domestic investment in the field alone will top 60 bn yuan (US$7.23 bn).
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